As part of a partnership with University at Buffalo’s TCIE (formerly The Center for Industrial Effectiveness), the SUNY Fredonia Technology Incubator at 214 Central Ave., Dunkirk, NY, will once again host the Certified Lean Professional (CLP) course during spring 2013 and offer three new courses.
The lineup includes:
- CLP: 8:30 to 11:30 a.m. on March 6, 13, 20 and 27; April 10, 17 and 24; May 1, 8, 15 and 22; June 11; and July 16. The 39-hour course introduces participants to the Lean methodology of saving money and reducing waste by identifying unnecessary processes.
- Intellectual Property Breakfast Seminar: 8 to 10 a.m. on March 26. The seminar provides participants with a basic knowledge of patents, copyrights, trademarks, trade-secrets, licensing, patent trolls, and a look at defensive publishing.
- Root Cause Analysis & Corrective Action training: 8 a.m. to 5 p.m. on April 25. This interactive, full-day session is designed to improve the problem-solving skills of all employee levels by providing an understanding of the processes and techniques for root cause analysis and effective corrective action.
- Knowledge-Driven New Product Development course: 8:30 a.m. to 3:30 p.m. on May 23. The course is designed to allow each participant to develop a vision for new product development (NPD) in their own organization. Upon course completion, participants will be awarded an exclusive certificate from UB’s School of Engineering and Applied Sciences.
Registration deadlines vary per class. Go to www.tcie.buffalo.edu to register.
TCIE is an elite university extension program that supports hundreds of public and private organizations annually, connecting the business community with expert resources of the University at Buffalo’s School of Engineering and Applied Sciences. TCIE facilitates business growth and sustainable performance improvements through its engineering solutions, operational excellence services and professional development offerings.
To learn more, contact Tracy Puckett at 716-645-8845 or tracyrze@buffalo.edu.